High temperature shape memory polymer with high wear resistance

Abstract

High temperature shape memory polymers (SMP) have potentials in aerospace and electronic industries, while wear resistance can enhance reliability and service life of products. Here high temperature SMP with high resistance are prepared for the first time by introducing 3-aminopropyltriethoxysilane modified SiO2 nanoparticles (A-SiO2) into new shape memory polyimide (SMPI) matrix. The composite with 10% A-SiO2 exhibits high glass transition temperature (Tg) of 256 °C, complete shape fixity and shape recovery of 100%, and low wear rate of 1.67 × 10−9 g N−1 r−1. In comparison, neat SMPI exhibits poor wear resistance with serious damages after the same dry sliding, and its wear rate is 5.83 × 10−9 g N−1 r−1. The wear mechanism is studied and the wear evolves from adhesive and fatigue wear of neat SMPI to slight adhesive wear of the composite with 10% A-SiO2.