Abstract
Organic epoxy matrices have been widely used in the FRP reinforcing technique, but they have serious disadvantages of poor high-temperature resistance. An inorganic adhesive is invented to replace the organic adhesive. For the inorganic adhesive at normal temperature and different high temperatures, the microstructure and phase composition are investigated by means of X-ray diffraction (XRD) and SEM respectively. Results show that inorganic adhesive can resist at least 600 °C high temperature. Fire-resistance performance of inorganic adhesive can meet the requirements of fiber reinforced polymer (FRP) strengthened RC structures.
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