Abstract
AbstractThe packaging insulation material was a crucial component to guarantee the stable and safe operation of electronic devices. Epoxy resin, one of the most popular packaging materials, was widely used as an electronic packaging material because of its good corrosion resistance and electrical insulation, low price, and easy processing and molding. However, the unsatisfied heat resistance cannot meet the requirements of the rapid development of third‐generation power semiconductors, so it was meaningful to modify the epoxy resin with both excellent heat resistance and insulation. In this paper, tetrafunctional epoxy resin AG70 and phenolic epoxy resin F51 was blended in different proportions to combine their individual advantages, and the microstructure and electrical/thermal properties of epoxy resin blends had been systematically studied. The results showed that with the increase of blending ratio of AG70 with F51, both high glass transition temperature of 213.3°C and electric breakdown of 206.1 kV/mm were achieved when the blending ratio was 5:5, displaying excellent overall performances and exhibiting great application potential in electronic and microelectronic industries.
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