High temperature performance adhesive derived from randomly segmented poly (imide siloxane) copolymer

Abstract

The thermal resistance of the randomly segmented poly (imide siloxane) copolymer in adhesive form was improved as the synthetic polymer with siloxane (linked by imide units with the random form of poly (imide siloxane) copolymer). The adhesion strength of the randomly segmented poly (imide siloxane) copolymer adhesive was performed at 1 mm thickness with 6.28 E-6 m2 (6.28 mm2) surface area in a 1 cm radius. After this copolymer was adhered to the surface of the poly (methyl methacrylate) used as a space-grade thermoplastic substrate there was no failure or any dimensional change on the copolymer adhesive at the end of ten days. This result indicated that the strong bonding was achieved at 1162,89 N/m2 on the surface of the thermoplastic substrate used as the substrate in the adhesion test of the randomly segmented poly (imide siloxane) copolymer adhesive) after the cooling processing of the adhesive. The cooling processing was applied to the adhesive for the examination of the adhesive performance. In the cooling process, the adhesive has been kept cold (-5 °C) in dark for 6 months. The bonding properties of the adhesive including Si (111) crystalline were investigated and the results indicated that the adhesive was resistant to high-temperature applications until 350 °C. The formation of polysilicon-11 (as the silicone bulk in 3D) in the adhesive was significant to solve the thermal problems for the generation of the low-dimensional system (called quantum confinement effect).