Abstract
The high temperature damping behavior of (submicron + micron) bimodal size SiCp reinforced Mg matrix composite was investigated in present study. Results revealed that the addition of bimodal size SiCp brought a moderate activation energy of grain boundary peak for Mg matrix as compared with the composite reinforced by single sized submicron/micron SiCp. Even though the volume fraction of micron SiCp was nine times the submicron SiCp, the position of recrystallization peak and high temperature damping behavior of bimodal size SiCp reinforced Mg matrix composite was mainly controlled by 1vol% submicron SiCp.
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