Abstract
Compression creep behavior of the 8009 alloy and SiC/8009 composite has been investigated at the temperatures ranging from 573 to 723 K. The addition of SiC whiskers in the 8009 alloy decreases creep rates by two orders of magnitude. The stress and temperture dependence of creep rates of the composite is similar to those of the 8009 alloy. Creep rates of the 8009 alloy and the composite are controlled by lattice diffusion of aluminum. The threshold stress for creep was used to analyze the experimental data of the 8009 alloy and the composite.
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