Abstract
The subject of this work is to develop contact joints between a CoSb 3 thermoelectric material and a copper electrode. The CoSb 3–Cu junctions were produced by the resistance brazing (RB) technique in the atmosphere of protective gases (90% Ar + 10% H 2), with the application of Ag–Cu metal fillers. The diffusion barriers (Ni, Mo, Cr 80Si 20) on the TE segments made of the polycrystalline CoSb 3 were prepared by the magnetron sputtering method. The microstructure and the chemical composition of the joints were examined using a scanning microscope (SEM) with an X-ray energy dispersion analysis (EDX). The examinations of the electrical parameters of the joints such as: the Seebeck coefficient, resistivity, and current–voltage characteristics were performed by a scanning thermoelectric microprobe (STM).
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
