Abstract
We demonstrate a membrane photonic integrated circuit (MPIC) that includes a membrane distributed feedback (DFB) laser and a p-i-n photodiode with a buried-ridge-waveguide (BRW) on a Si substrate, using a-Si nanofilm-assisted room-temperature surface activated bonding (SAB) for on-chip optical interconnection. The BRW structure enhanced the lateral optical confinement compared with that of the conventional flat structure. The directly bonded membrane DFB laser using SAB had a lower thermal resistance and higher output power than the previous structure using a benzocyclobutene (BCB) bonding layer. The DFB laser had a low threshold current of 0.27 mA at 25 °C. The maximum detected photocurrent and slope efficiency were 0.95 mA and 0.203 mA/mA, respectively, at 25 °C. The MPIC was successfully operated at temperatures up to 120 °C. The 3-dB bandwidths of 16.8 GHz and 10.1 GHz were achieved at 25 °C and 80 °C, respectively, and 25 Gbps and 15 Gbps non-return-to-zero (NRZ) 215-1 pseudo-random bit sequence signals were recorded at 25 °C and 80 °C, respectively.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
