Abstract
A low-temperature co-fired ceramic (LTCC)-based optocoupler design is demonstrated as a possible solution for optical isolation in high-density integrated power modules. The design and fabrication of LTCC based package are discussed. Commercially available aluminum gallium arsenide/gallium arsenide (AlGaAs/GaAs) double heterostructure is used both as emitter and photodetector in the proposed optocoupler. A detailed study on the electroluminescence and spectral response of the AlGaAs/GaAs structure is conducted at elevated temperatures. The material figure of merit parameter, D*, is calculated in the temperature range 77–800 K. The fabricated optocoupler is tested at elevated temperatures, and the results are presented.
Highlights
A low-temperature co-fired ceramic (LTCC)-based optocoupler design is demonstrated as a possible solution for optical isolation in high-density integrated power modules
An enhanced spectral response is observed at elevated temperatures
A high-temperature optocoupler based on LTCC packaging is demonstrated as a possible solution for optical isolation in future high-density power modules
Summary
A low-temperature co-fired ceramic (LTCC)-based optocoupler design is demonstrated as a possible solution for optical isolation in high-density integrated power modules. Available SiC devices, rated 900 V and above, with a chip size spanning few millimeters, enables the development of high-density power modules with a low form factor[4]. The miniaturization of the wide bandgap-based power electronic system is mainly made possible by utilizing the higher junction temperature operations and SiC devices, eliminating a bulky cooling system[8,9]. The high temperature rated magnetics, such as isolation transformers, are bulky in design, leading to comparatively lower power density modules. This study demonstrates the development of high-temperature optocouplers and examines the possibility of driving miniaturization trends in high-density power modules by eliminating the volumetric issues in design architecture
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
