High surface quality micro machining of monocrystalline diamond by picosecond pulsed laser

Abstract

In micro machining of monocrystalline diamond by pulsed laser, unique processing characteristics appeared only under a few ten picosecond pulse duration and a certain overlap rate of laser shot. Cracks mostly propagate in parallel direction to top surface of workpiece, although the laser beam axis is perpendicular to the surface. This processed area can keep diamond structure, and its surface roughness is smaller than Ra = 0.2 μm. New laser micro machining method to keep diamond structure and small surface roughness is proposed. This method can contribute to reduce the polishing process in micro machining of diamond.