High strength and high light transmittance sapphire/sapphire joints bonded using a La2O3-Al2O3-SiO2 glass filler

Abstract

A novel La2O3-Al2O3-SiO2 (LAS) glass was used as filler to join transparent sapphire for obtaining high strength and high light transmittance joints. The results show that the LAS glass filler had compatible coefficient of thermal expansion (CTE) with sapphire and excellent wetting ability on sapphire. During the joining process, no interfacial reaction occurred and the brazing seams were in a completely amorphous state under fast cooling conditions (~50 °C/min). With increased joining temperature, the mutual dissolution and diffusion between sapphire and the LAS filler were enhanced. The flexural strength of joints first increased and then decreased with an increase in the joining temperature from 1400 °C to 1550 °C. The optimal flexural strength of joint reached 325 MPa, which almost was the same as the strength of sapphire substrate. At 500 nm, the in-line transmittance of this joint was 80.5%, which was close to that of sapphire (84.2%).