High Speed Processing for Microelectronics and Photovoltaics

Abstract

AbstractQ‐switched infrared, green, UV and DUV lasers are being used routinely for various microelectronics and photovoltaic manufacturing applications, such as ablation and cutting of dielectric materials, LED scribe and cleave processes in microelectronics, and scribing thin film solar cells.To create functional good results when micromachining any material, the laser energy density needs to be set higher than the material removal threshold and a reasonable laser beam spot overlap is required. The maximum scribing speed achieved using a system with a pulsed laser source therefore is usually limited by the laser repetition rate and the energy per pulse available at that repetition rate. For a given repetition rate, as processing speed increases the beam spot overlap decreases and at certain critical processing speed laser beam spots gets separated in space and continuous scribing of material is not possible. This fundamental limitation has to be solved in order to achieve faster processing speeds, higher throughput, and lower cost per part.To overcome this limitation in next generation laser processing systems, SpectraPhysics has developed and evaluated high repetition rate mode‐locked lasers as an alternative to Q‐switched lasers. Using a high average power mode‐locked laser operating at 80 MHz, we have been able to demonstrate processing speeds that are an order of magnitude higher in thin layers of select materials than that with current Q‐switched technology. The following article reviews results obtained for micromachining dielectrics, scribing and cleaving blue LEDs, and scribing different solar cell materials.