Abstract
A permanent task of the electronic industry is to find methods in order to reduce production costs which are characterised by higher mass-production output. Besides the choice of less expensive coating materials, high-speed plating is a further possibility. High-speed plating brings about an increase in output or a minimisation of ground space and/or investment. The publication describes the principles, possibilities and limitations of high-speed plating technology in the scope of four different applications. These applications are: the selective coating of contact materials in reel-to-reel continuous plating lines, the continuous copper plating of printed circuit boards, the high-speed plating in product-specific plating tools integrated into an inter-linked production and the electroforming of microstructures.
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