High-Speed Bonding of Resin-Coated Cu Wire and Sn Electrode with Ultrasonic Bonding for High-Frequency Chip Coil

Abstract

High-speed ultrasonic bonding method has been developed to join resin-coated Cu wire on Sn electrodes for high-frequency chip coils. Two-step amplitude method, which decreases the ultrasonic amplitude in the bonding process, was effective to join the resin-coated Cu wire on Sn electrodes. The surface roughness treatment for a bonder head accelerated the deformation of the wire in the bonding process and improve the bondability compared to using the bonder head without that treatment. This paper also describes bonding properties of the joint and the bonding mechanism.