High resolution printing processes with high throughput, enhanced step coverage, and high design flexibility

Abstract

Reverse offset printing and microcontact printing are fascinating methods for fabricating fine patterns because both of them can attain a 1-µm/1-µm line-and-space resolution, and the resulting patterns manifest uniform layer-thicknesses irrespective of the pattern sizes. However, the printed pattern has very sharp edges; therefore, the step-coverage of subsequent overlying layers has often been a severe problem. Further, as reverse offset printing and microcontact printing use an engraved glass and a stamp, respectively, the pattern design is restricted because of bottom-contact-type defects. Thermal sintering of the printed patterns also leads to a longer processing time. To address these problems, we have developed several complementary processes. In this presentation, wet-on-wet, electrode-embedding, and push-pull processes and a newly developed high-resolution planographic method called adhesion contrast planography are discussed.