Abstract
ABSTRACTOne-micrometer wide copper lines are patterned by direct imprinting and thermolysis. First, a layer of plastic copper hexanoate is spun on a substrate and patterned by direct imprint. Then the copper hexanoate line pattern is converted to copper metal lines by thermal and hydrogen anneals. The converted copper film resistivity is ∼8 μωcm. The direct imprinting of a fine metal pattern points the way to the direct patterning of device materials at high resolution
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