Abstract
ABSTRACTOne-micrometer wide copper lines are patterned by direct imprinting and thermolysis. First, a layer of plastic copper hexanoate is spun on a substrate and patterned by direct imprint. Then the copper hexanoate line pattern is converted to copper metal lines by thermal and hydrogen anneals. The converted copper film resistivity is ∼8 μωcm. The direct imprinting of a fine metal pattern points the way to the direct patterning of device materials at high resolution
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
