Abstract

We propose a new capacitive microinclinometer where oblique comb electrodes and double-folded suspension springs are aligned parallel to the vertical (111) plane of (110) silicon. The oblique comb utilizes both the overlapped area and the gap between movable and stationary electrodes, resulting in a considerable increase in sensitivity (capacitance change/angle). The resolution becomes even higher by taking advantage of the smooth (111) sidewalls of the oblique comb electrodes, which are fabricated using silicon deep reactive ion etching followed by crystalline wet etching. The surface roughness was reduced from 200 (R <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">rms</sub> ) to 20 nm (R <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">rms</sub> ), and the verticality was improved from 88.7° to 89.7°. The capacitance change of the fabricated inclinometer experimentally ranges from -0.793 to 0.783 pF for the full range of inclination angle (from -90° to 90°). The estimated worst resolution, which is obtainable at an inclination angle of ±85°, was as low as 0.25°.

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