High reliable medium profile copper foil for automobile PCB and IC

Abstract

The Nan Ya MP (Medium Profile) foil is designed to satisfy the market between high roughness HTE foils and low peeling VLP foils. This foil possesses optimum mechanical, physical and chemical properties, which is especially suitable for high reliability application. By the aid of well designed formula, the MP foil breaks the contradiction between low surface roughness and high peel strength. The peel strength of the MP foil is almost the same or even higher than HTE foil, and the surface roughness is lower than HTE foils. In order to achieve the low surface roughness and high peel strength of MP foils, the mountain-type nodule of raw foils are designed to be much lower and shorter, but the number is increased. By special nodule treatment technique, the high density nodules particles are deposited on the surface of MP foil. That is why the MP foils have low surface roughness and high peel strength. Owing to the optimum combination of raw foil and nodule treatment, the MP foils show excellent etching performance. Moreover, even after 250°C X 1 hr oven condition, the MP foils almost maintain high tensile strength and elongation, thus the MP foils are much more reliable in high temperature lamination or in other high temperature application field (ie automobile PCB).