Abstract

Thermal stability, optical reflectivity, and contact resistivity of Pd∕Ni∕Al∕Ti∕Au ohmic contacts to p-type GaN were investigated. In contrast to its Pd∕Al∕Ti∕Au counterparts, Pd∕Ni∕Al∕Ti∕Au contacts retained their specific contact resistivity (<2×10−2Ωcm2) and reflectivity (>76%) after long-term annealing at 150 °C in nitrogen ambient. According to the results of the secondary ion mass spectroscopy study, it is suggested that the Ni layer prevents the penetration of Ti into GaN during thermal treatment.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.