Abstract
Application of periodic reversal (PR) technique, in which a cathodic (depositing) step is followed by an anodic (polishing) step, was found very beneficial to the increase of electroplating rate of coherent niobium. With no mechanical agitation, the application of the PR technique facilitated an electroplating rate increase by a factor of about 10 over the direct current method. The morphology of the deposits was found to be of the columnar structure. The columns became more oriented along the [100] direction, and of smaller diameters as the rate of electrodeposition increased. Unexpectedly, beyond a certain rate and under certain conditions, the columnar grains became large once again. Under such conditions a pronounced heteroepitaxial effect of the substrate (Cu) grains on the deposit grain size and orientation was observed.
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