High Quality Test Methodology for Highly Reliable Devices

Abstract

This paper introduces a high quality screening methodology, using Integrated Passive Device (IPD) as an example device, which has the capability to increase power integrity of Integrated Fan Out Wafer Level Chip Scale Package (InFO WLCSP). InFO WLCSP is a more cost effective solution to achieve “More than Moore's law” for mobile devices than 3D integrated circuits (3DIC). Ultra-thin IPD with high capacitance density is capable to further shrinking InFO package dimensions and boosting its performance. Although the cost percentage of an IPD in the whole InFO package is negligible, a defective IPD can cause the whole InFO package malfunctioned. Traditional test methods such as good die in a bad cluster (GDBC) and dynamic part averaging testing (DPAT) are used screening IPD devices, however it is insufficient for high quality screen standards. In this paper, we propose a novel methodology that leads to an effective screening method to guarantee high quality and reliable IPD devices for InFO packages. We will show results on some industrial cases to validate our claims.