Abstract
A novel bulk silicon micromachining technique for fabricating millimetre-wave waveguide components is presented. This technique enables the formation of deep three-dimensional stacked structures of almost constant cross-section as well as post wafer-bonding metallisation that reduces the effects of air gaps and contact resistances. With these innovations it is possible to realise high-Q devices with low-cost fabrication. Simulated and measured results for a 30 GHz silicon cavity resonator are presented.
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