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Abstract
Soldering using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glass, ceramics, and optical crystals. This is due to a localized and minimized input of thermal energy. Solderjet bumping technology has been used to assemble a lens mount breadboard using specifications and requirements found for the optical beam expander for the European Space Agency EarthCare Mission. The silica lens and a titanium barrel have been designed and assembled with this technology in order to withstand the stringent mission demands of handling high mechanical and thermal loads without losing the optical performance. Finally, a high-precision optomechanical lens mount has been assembled with minimal localized stress (<1 MPa) showing outstanding performance in terms of wave-front error and beam depolarization ratio before and after environmental tests.
Published Version
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