Abstract
A trend exists towards higher power densities in power electronic, driven by the applications market and new technologies.The hybrid integration of semiconductor devices represents the first level of power electronic integration. At higher levels passive components will be included in the same package and eventually complete power electronic converters could be integrated. This calls not only for more compact three dimensional packaging techniques but electromagnetic integration of the passive circuit functions and integrated heat management of all the circuit components. In the paper various issues for achieving high power densities and higher levels of integration are discussed including geometrical packaging, electromagnetic and thermal issues. Some practical examples will also be presented ad case studies.
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