Abstract
The high efficient heat dissipation structure, microchannel cooling structure, is applied to improve the power capacity of a W-band sheet beam extended interaction oscillator (SB-EIO). The configuration of microchannel is designed and optimized to enhance the efficiency of heat dissipation. The results show that microchannel cooling technology increases the tolerable electronic interception rate to 4% (49-kV and 2-A sheet beam) with 3.6-kW output power and 2.3-kW ohm loss, and improves the power capacity of continuous wave output power to 7 kW with 2% electronic interception.
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