High-Performance, Wide-Bandgap Power Electronics

Abstract

APEI has developed high-performance electronics to exploit the unique capabilities of wide-bandgap devices. Crucial enabling features include high current density, fast switching speed, high-voltage (>10 kV) blocking, high-temperature operation (>200°C), and inherent radiation tolerance, features which have the potential to completely revolutionize existing electronics, from milliwatt to megawatt levels, and enable operation in new environments. Full realization of these extraordinary capabilities led to significant challenges in package and system design, including high electric fields, high power density, high di/dt’s and dv/dt’s, and high temperatures. Because of the limitations of traditional design methods and traditional electronics, designers unknowingly lack understanding of packaging material thermal properties at temperature extremes, of package-fabrication techniques, and of the inability to operate continuously at elevated temperatures, and use a set of qualification standards designed for lower-temperature, previous generation technology.