Abstract
In the present study, a high-performance n-type temperature sensor was developed by a new and facile synthesis approach, which could apply to ambient temperature applications. As impacted by the low sintering temperature of flexible polyimide substrates, a screen printing technology-based method to prepare thermoelectric materials and a low-temperature heat treatment process applying to polymer substrates were proposed and achieved. By regulating the preparation parameters of the high-performance n-type indium oxide material, the optimal proportioning method and the post-treatment process method were developed. The sensors based on thermoelectric effects exhibited a sensitivity of 162.5 μV/°C, as well as a wide range of temperature measurement from ambient temperature to 223.6 °C. Furthermore, it is expected to conduct temperature monitoring in different scenarios through a sensor prepared in masks and mechanical hands, laying a foundation for the large-scale manufacturing and widespread application of flexible electronic skin and devices.
Highlights
As electronic products are being developed to be increasingly small, light and thin, flexible printed circuit boards (FPCB) have been extensively applied in several fields for their small size, light weight, static bending and dynamic folding and curling [1,2,3,4]
As flexible electronic devices are being increasingly demanded, and the manufacturing technology is leaping forward, numerous materials are continuously emerging, which can undergo a close integration with flexible polymer substrates via a multi-style manufacturing process, as an attempt to replace conventional conductive inks
To prepare thermoelectric films by using screen printing, the ratio of materials and the selection of subsequent heat treatment processes are of high significance and can directly affect the practical performance exhibited by the temperature sensor
Summary
Epoxy resin (E-51) and polyether amine (D-400) were taken as the binder and curing agent to bond the thermo-electrode powder In2 O3 and ITO. Per thermo-electrode commonly conducts the process in Figure 1a once or twice. Thermo-electrode was processed on a heating stage at 150 ◦ C for nearly 15 min to ensure its complete solidification. After the positive and negative thermal electrodes were prepared by screen printing in turn, the sensor was heat-treated at 350 ◦ C to conduct thermal activation of the electrode materials
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