High-Performance Planar Thermal Diode With Wickless Components

Abstract

Abstract The characterization “thermal diode” (TD) has been used to portray systems that spread heat very efficiently in a specific direction but obstruct it from flowing in the opposite direction. In this study, a planar vapor chamber (VC) with a wickless, wettability-patterned side and an opposing wick-lined side is fabricated and tested as a thermal diode. When the chamber operates in the forward mode, heat is naturally driven away from the heat source; in the reverse mode, the system blocks heat flow, thus acting as a thermal diode. The low-profile assembly takes advantage of the phase-changing properties of water inside a sealed chamber. The wettability-patterned plate—when on the cooled side, e.g., forward operation mode—enables spatially controlled dropwise condensation (high heat transfer rate) and filmwise condensation (high drainage rate), thus facilitating an efficient transport mechanism of the condensed medium on superhydrophilic wedge tracks by way of Laplace pressure-driven capillary forces. The same chamber acts as a thermal blocker when the wick-covered plate is on the cooled side (reverse operating mode), trapping the condensate in the wick pores and blocking heat flow to the opposite side. The system's thermal behavior is similar to the theoretical electrical diode. This work explores the effect of the condenser's wettability pattern design and the chamber's fluid charging ratio (CR). With this system, thermal diodicities exceeding 20 have been achieved, and are tunable by altering the wettability pattern. The thermal rectification concept and its proper quantification in terms of possible definitions are discussed. The present vapor chamber—thermal diode design could be well-suited for an extensive range of thermal-management applications, ranging from aerospace, spacecraft, and smart-building construction materials, to electronics protection, electronics packaging, refrigeration, thermal control during energy harvesting, thermal isolation, etc.