High performance organic thin film transistors using chemically modified bottom contacts and dielectric surfaces

Abstract

A compatible process of orthogonal self-assembled monolayers (SAMs) is applied to intentionally modify the bottom contacts and gate dielectric surfaces of organic thin film transistors (OTFTs). This efficient interface modification is first achieved by 4-fluorothiophenol (4-FTP) SAM to chemically treat the silver source–drain (S/D) contacts while the silicon oxide (SiO2) dielectric interface is further primed by either hexamethyldisilazane (HMDS) or octyltrichlorosilane (OTS-C8). Results show that the field effect mobilities of the bottom-gate bottom-contact PTDPPTFT4 transistors were significantly improved to 0.91cm2V−1s−1.