Abstract

We report on high performance field-effect transistors fabricated with pentacene as an active material and Al<sub>2</sub>O<sub>3</sub> as a gate dielectric material grown by atomic layer deposition (ALD). These transistors were operated in enhancement mode with a zero turn-on voltage and exhibited a low threshold voltage (< -10 V) as well as a low subthreshold slope (< 1 V/decade) and an on/off current ratio larger than 10<sup>6</sup>. Hole mobility values of 1.5 ± 0.2 cm<sup>2</sup>/Vs were obtained when using heavily n-doped silicon (n<sup>+</sup>-Si) as gate electrodes and substrates. Atomic force microscopy (AFM) images of pentacene films on Al<sub>2</sub>O<sub>3</sub> treated with octadecyltrichlorosilane (OTS) revealed well-ordered island formation, and X-ray diffraction patterns showed characteristics of a "thin film" phase. Compared with thermally-grown SiO<sub>2</sub>, Al<sub>2</sub>O<sub>3</sub> gate insulators have lower surface trap density and higher capacitance density, to which the high performance of pentacene field-effect transistors can be attributed.

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