High-performance near-substrate heat sink with Tesla-like rotor-wing microchannel for chiplet cooling application

Abstract

Microchannel heat sink provides a viable solution for enhancing thermal management in high-power chiplets. However, in consideration of cooling efficiency, low pressure drop, cost-effectiveness and reliability, it’s challenging to create an effective heat sink for a million-watt chip. Inspired by Tesla structure, this study introduces a Tesla-like rotor-wing microchannel (TRWM) to boost cooling performance. Due to the features of main channels, branch channels, and micro-islands in TRWM design, fluid in microchannel is effectively mixed and stirred with varied flow patterns, high temperature gradients and significant velocity gradients, which enhances the cooling capacity through precise fluid dynamics adjustment. Three different TRWMs are designed and compared by simulations. And the simulated results show that TRWM of 135° model achieves a maximum heat flux of 1514 W cm−2 @0.1 cm2 under a 60 K temperature rise, improving cooling efficiency by 19.4 % over the traditional channel design with 1221 W cm−2 @0.1 cm2. And then, the TRWM is fabricated using Ultraviolet Lithgraphie Galvanoformung Abformung (UV-LIGA) and bonding processes. Ultimately, the fabricated 135° TRWM sample demonstrated a heat dissipation capacity of up to 1446 W cm-2 @0.1 cm2 with a temperature increase of 60 K, which corresponds well with the simulated results. Moreover, the discrepancy between the actual and simulated values is less than 6.3 % under the same conditions. This performance provides a practical design solution for chiplet cooling and highlights the potential of bioinspired microfluidics.