Abstract
This paper presents a novel FDSOI FinFETs with SiGe channel/Si cap layer (35 nm/5 nm) formed on SOI wafers with 20 nm Si body. Electrical characterization result shows that JL FDSOI FinFETs with SiGe channel exhibited low subthreshold slope (SS) of 86 mV/decade and record high ON-OFF current ratio (ION/IOFF = 2 × 106) at VD = -0.5V, respectively. Device performance improvement was mainly attributed to high-epitaxial quality compressive strained SiGe channel and novel device structure. The strain in the channel of the transistors was estimated locally in TEM using Nano beam diffraction (NBD) technique. The FDSOI FinFET with SiGe channel, lays the foundation for the further development of high speed, high density, low cost, and 3D monolithic integration circuits.
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