Abstract
We developed a new concept flip-chip ball grid array (FCBGA) based on multi-layer thin-substrate (MLTS) packaging technology in order to meet the strong demand for high-density, high-performance, and low-cost LSI packages. The most important feature of MLTS packaging is that, only a high-density and high-performance MLTS remains by removing the metal plate after mounting an LSI chip. The MLTS packaging offers the advantages of (1) good registration accuracy, which makes higher-density and finer-pitch pattering possible; (2) an ideal multi-layer structure that is highly suitable for high-speed and high-frequency applications; (3) excellent flip-chip mounting reliability, which makes higher-pin-count and finer-pitch area array flip-chip interconnection possible; (4) excellent reliability, supported by use of high T g (glass transition temperature) resin; and (5) a cost-effective design achieved as a result of fewer layers fabricated with fine-pitch patterning. We successfully produced a high-performance FCBGA prototype based on our MLTS packaging technology. The prototype comprises an LSI chip connected to approximately 2500 bonding pads arranged in 240 μm pitch area array, and 1296 I/O pads for BGA. The prototype FCBGA’s excellent long-term reliability was demonstrated through a series of tests conducted on it.
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