High performance epoxy resin with efficient electromagnetic wave absorption and heat dissipation properties for electron packaging by modification of 3D MDCF@hBN

Abstract

Exploiting electronic packaging materials with simultaneously high thermal conductivity and electromagnetic wave absorbing capacity has been considered as a key strategy to resolve the ever-increasing heat flux density and electromagnetic interference of integrated circuits, although it is hard to achieve. Here, we report 3D MDCF@hBN filled epoxy resin (i.e., MDCF@hBN/EP) as a promising candidate. 3D MDCF@hBN was created by self-assembling negative charged hydroxyl-modified hBN on the surface of positive charged melamine foam through electrostatic effect, and subjected to carbonization at 900 ℃. In which, the hBN can enhance the dielectric loss capability and impedance matching of MDCF, resulting in the minimum reflection loss (RL)value of − 52.77 dB at 9.36 GHz and the maximum effective absorption bandwidth of 5.60 GHz (from 12.40 to 18.00 GHz) for 25 wt% MDCF@hBN filled EP. In addition, the 3D MDCF@hBN also acts an effective heat propagation path in EP, leading to a high thermal conductivity of 0.99 W·m−1 K−1 at room temperature, 450% higher than that of pristine EP. The coalesced high thermal conductivity and electromagnetic wave absorption performance in EP indicate that MDCF@hBN/EP has a promising practical application in high-power integrated circuits.