Abstract
A new plasma-enhanced organic monomer-vapor polymerization (PE-MVP) method is developed for deposition of divinyl siloxane bis-benzocyclobutene (DVS-BCB) polymer films with low dielectric constant, k=2.7. The PE-MVP method eliminates polymer oxidation of DVS-BCB during polymerization, improving the thermal stability. By combining the MOCVD-Cu technique with the PE-MVP, narrow-pitch Cu/BCB damascene lines reveal a 35% reduction in the line capacitance compared to Cu/SiO/sub 2/ lines, while the interline leakage current is kept as low as 5/spl times/10/sup -9/ A/cm/sup 2/.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
