Abstract

Abstract Highly reliable Cu micron network transparent film on flexible polyethylene terephthalate (PET) substrate, which has excellent conductivity, improved thermostability and enhanced adhesion is prepared via electroplating and lithography without high temperature and vacuum environment. The sheet resistance of the Cu micron network flexible films obtained by this work is ~2.0 Ω/sq with the transmittance of ~86%, and almost unchanged in the peeling strength of 4.0 MPa. The fabricated Cu micron network establishes strong adhesion to PET substrates, thus mechanical stability against taping and compressive bending is attainable. Moreover, the Cu micro network films show a good stability to resist long-term storage and high temperature (300 °C). The thermal performance of the Cu micro network films as visible transparent heaters via Joule heating is also demonstrated. In addition, good durability and flexibility are also found by being dressed in the human body while maintaining the excellent performance.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.