High‐level integrated passive triplexer and quintplexer module in organic SOP technology

Abstract

AbstractIn this letter, fully embedded passive triplexer and quintplexer module into organic packaging substrate were presented for US CDMA handset applications. First, the passive triplexer was implemented by embedding all passive elements and circuits into multilayered organic packaging substrate. The passive triplexer circuit with eight passive elements was comprised of a diplexer, parallel resonator, and matching network. The size of the fabricated triplexer was 3 mm × 4 mm. The compact CDMA quintplexer module was fabricated by assembling the embedded passive triplexer with DCN and PCS duplexers on FR‐4 evaluation board. A fabricated quintplexer module exhibited an insertion loss of −2.2 dB/−2.9 dB at DCN Tx/Rx band, −3 dB/−2.7 dB at PCS Tx/Rx band, and −2.4 dB at GPS Rx band, respectively. In addition, the stop‐band attenuation is −40 dB/−44 dB at DCN Tx/Rx band, −55 dB/−45 dB at PCS Tx/Rx band, and −37 dB at GPS Rx band, respectively. Measured isolations in each Tx band are −62 dB/−58 dB at GPS/PCS of DCN band, −30 dB/−36 dB at DCN/PCS of GPS band, and −45 dB/−38 dB at DCN/GPS of PCS band. It is comparatively much higher than the matching circuit type quintplexer module, which indicates that the embedded triplexer is strongly applicable for improving the interferer blocking. The simulated performance characteristics were agreed with the simulated ones. ©2009 Wiley Periodicals, Inc. Microwave Opt Technol Lett 52: 302–306, 2010; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.24923