Abstract

We report the demonstration of strained GeSn channel pMOSFETs on (111)- and (100)-oriented Ge substrates. The Sn composition is 4.1%. The device interface is passivated using (NH4)2S solution. Compared to devices on Ge(100), GeSn pMOSFETs on Ge(111) demonstrate a 20% enhancement in effective hole mobility at an inversion charge density (Qinv) of 2 × 1013 cm-2.

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