Abstract

This paper reports on polysilicon piezo-resistors that are fabricated at a low thermal budget using aluminium-induced-crystallization (AIC) of ultra-high-vacuum e-beam evaporated silicon films. By in-situ phosphorus doping of precursor amorphous silicon films e-beam evaporated at room temperature on aluminium layer, we are able to increase and control the gauge factor of the polysilicon films formed by AIC at 450 °C. Piezo-resistors made from the polysilicon films are integrated on microcantilever beams to measure their gauge factors. Gauge factors as high as 62 is obtained for 2 × 1018/cm3 phosphorus doping level in the precursor amorphous silicon film. The measured gauge factors are significantly higher than previously reported values for polysilicon films.

Highlights

  • Fabricating sensors and actuators at low thermal budget is necessary for post CMOS-MEMS integration

  • Their use for piezo-resistive applications has been limited due to the formation of polysilicon films with small gauge factor of less than 20 [2,3]. This may be attributed to the formation of small grain size and fixed Al doping of 2.8 × 1018/cm3 in the AIC polysilicon films

  • We report the enhancement of the gauge factor of AIC polysilicon film by in-situ phosphorus doping of the precursor amorphous silicon that is e-beam evaporated at ultra-high vacuum

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Summary

Introduction

Fabricating sensors and actuators at low thermal budget is necessary for post CMOS-MEMS integration. In-situ doping of epitaxially grown c-silicon and LPCVD polysilicon are demonstrated for fabricating silicon piezo-resistors. These processes require high temperature making them incompatible with post CMOS-MEMS integration. AIC polysilicon films formed at temperatures less than 550 °C is commonly used for solar cell applications [1] Their use for piezo-resistive applications has been limited due to the formation of polysilicon films with small gauge factor of less than 20 [2,3]. This may be attributed to the formation of small grain size and fixed Al doping of 2.8 × 1018/cm in the AIC polysilicon films. We report the enhancement of the gauge factor of AIC polysilicon film (formed at 450 °C) by in-situ phosphorus doping of the precursor amorphous silicon that is e-beam evaporated at ultra-high vacuum

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