Abstract
AbstractA high gain D‐band hybrid integrated on‐chip antenna (OCA) based on a low‐cost printed circuit board (PCB) packaging technology is analyzed and designed in a standard 40‐nm CMOS process in this paper. The proposed OCA is a hybrid structure of a slotted patch OCA with off‐chip PCB ground and off‐chip dielectric resonator (DR). The proposed OCA exhibits a simulated gain of 3.5 dBi and 53% radiation efficiency at 150 GHz. The simulated impedance bandwidth is 20 GHz. The radiation performance and impedance bandwidth of the OCA are observably improved with the proposed techniques. The proposed OCA occupies 0.52 × 0.56 mm2, and addresses the highly desirable yet challenging overall design of future low‐cost integrated millimeter‐wave (mm‐Wave) and terahertz (THz) systems, which hit the mark on cost and compatibility.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
