High frequency substrate materials with highly thermal resistance and low dielectric properties

Abstract

A variety of electronic products, light, thin, short, small basic needs, and in the high-function, high transmission, high efficiency operation, the promotion of electronic products to the multi-function, high speed and high power aspects of the design, the development of copper clad laminate with both of better thermal resistance and low dielectric insulating substrate material simultaneously is expected to dominate the market in the near future. In this study, a new developed dielectrics exhibit high thermal stability and can pass the UL-94 V0 flame retarding standard without the use of halogen or phosphorous flame retardant. Copper clad laminate from AIS dielectric shows high Tg, good thermal properties, low dielectric properties and is compatible with traditional FR-4 processing condition. Copper clad laminate from AISB dielectric shows super high Tg (Tg > 240 °C), good thermal properties, low dielectric properties and can pass the UL-94 V0 flame retarding standard. It is believed that the new developed AIS and or AISB resin impregnate with low Dk glass cloth will be surely quite potential application in high-frequency substrate materials and meets global environmental regulations.