Abstract

It has been shown recently that shear horizontal acoustic waves propagating in piezoelectric plates whose thickness h is much less than the acoustic wavelength λ possess a number of attractive properties for use in sensor and signal processing applications. In order to exploit the potential benefits of these waves, however, one needs to fabricate devices on very thin plates. We have developed a suitable fabrication method which can be used to realize devices on such thin plates. In this method, the device is first fabricated on a plate of normal thickness (approximately 500 μm) and the substrate is then lapped from the back side to reduce the thickness. The technique has been utilized to realize devices on plates of thickness less than 70 μm. A shear horizontal plate acoustic wave (SH-PAW) delay line of fundamental resonant frequency greater than 25 MHz and insertion loss less than 7 dB has been realized on a 60 μm thick Y – cut, X – propagation lithium niobate substrate. The device also shows strong response near the third harmonic frequency of 75 MHz.

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