Abstract
High-frequency measurements of spin-valve films and devices, made using several different measurement techniques, are presented and compared. Pulsed inductive measurements were made on sheet films and provide insight into the intrinsic dynamical properties of the component films and multilayer stacks. The damping parameter, in the completed spin-valve stack, is larger than in the constituent films. Direct time and frequency domain measurements of the dynamical response of micrometer-size spin-valve devices, made using high-bandwidth magnetoresistance techniques, showed damping parameters comparable to these measured on spin-valve sheet films. The small-angle magnetization response was also determined by high-frequency magnetic noise measurements. The damping parameters were smaller than those obtained by direct susceptibility measurements. The device-level measurements show a different dependence of the damping parameter on the easy-axis field as compared to sheet-level measurements. In addition to the uniform rotation mode, other peaks can be observed in the noise spectra that correspond to fluctuation modes arising from the micromagnetic structure. Electrical device measurements have much greater sensitivity than other high-frequency magnetic measurement techniques, which allow the direct observation of magnetization motion in submicrometer elements without averaging. This technique is used to directly examine thermally activated events and nonrepetitive dynamical motions.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.