High-Frequency Heating for Soldering in Electronics

Vladimir L Lanin

doi:10.4236/cs.2012.33033

Abstract

Processes of high-frequency (HF) heating are examined and its parameters for the soldering of electronic modules are optimized. The advantages of HF heating are the following: selectivity by skin-effect; high density of energy; process- ing in any environment, including vacuum or inert gas; high ecological cleanliness, improvement solder flowing by electrodynamics forces increase the quality of soldering connections. Investigation of HF electromagnetic heating has allowed to optimize heating speed in local zones of soldering connections formation and to improve their quality due to joint action of superficial effects and electromagnetic forces.

Highlights

Importance of energy saving in technology forces to address to high-frequency (HF) electromagnetic heating providing of local high speed heating of conducting materials in any environment
The advantages of HF heating are the following: selectivity by skin-effect; high density of energy; processing in any environment, including vacuum or inert gas; high ecological cleanliness, improvement solder flowing by electrodynamics forces increase the quality of soldering connections
The choice of heating frequency, induction design and optimization of heating modes is necessary for formation of qualitative soldering connections in electronics products [1]

Summary

Introduction

Importance of energy saving in technology forces to address to high-frequency (HF) electromagnetic heating providing of local high speed heating of conducting materials in any environment. The choice of heating frequency, induction design and optimization of heating modes is necessary for formation of qualitative soldering connections in electronics products [1]. There is a big variety of induction heating devices designs [2]. To through heating conducting bodies of round, square and rectangular section, solder balls in electronics modules apply circular type inductor, flat bodies—inductors with magnetic gap or as flat spirals [3]. Small payments, wires use induction devices with closed and unclosed magnetic circuit. Quality of soldering connections depends on HF frequency, speed of heating, adjustability of heating in time and on section solderable details [4]

HF Heating Parameters Modeling

Experimental Techniques

Experimental Results and Discussion

Conclusions