Abstract
AbstractA simple method for analyzing the effects of TO packaging network on the high‐frequency response of photodiode modules is presented. This method is established based on the relations of the scattering parameters of the packaging network, photodiode chip, and module. It is shown that the results obtained by this method agree well with those obtained by the conventional comparison method. The proposed method is much more convenient since only the electrical domain measurements are required. © 2008 Wiley Periodicals, Inc. Microwave Opt Technol Lett 50: 1219–1223, 2008; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.23356
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