Abstract
Successful results on a development scale have demonstrated the benefits of x-ray lithography for producing fine features with broad process latitude. This paper is concerned with design of an x-ray source appropriate for production scale utilization of this technology. General considerations of throughput required show that, regardless of type, the source must provide several kilowatts of continuous x-ray power. At present, only synchrotrons can achieve this level. Conventional synchrotrons are too large for installation in a wafer fabrication facility, but superconducting synchrotrons can be relatively compact. Oxford Instruments Ltd. are presently building high-energy lithography illumination by Oxford’s synchrotron (HELIOS), a compact superconducting synchrotron, for installation in the IBM Advanced Lithography Facility at East Fishkill, New York. HELIOS will produce over 8 kW of continuous x-ray power with a characteristic critical wavelength of 0.84 nm. The design and performance of HELIOS are described, together with a discussion of the design choices which lead to the key features of HELIOS.
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More From: Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena
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