Abstract

Photomodulators for mm-wave and THz radiation are an essential component for many imaging and signal processing applications. While a myriad of schemes have been devised to enhance photomodulation by enhancing the light-matter interaction, there has been less focus on the photoconductive materials themselves, which are often the limiting factor. Here, we present an approach to increase the photomodulation efficiency of silicon by orders of magnitude, using post treatment of off-the-shelf silicon wafers. The increase in efficiency removes the need for bulky and costly amplified laser sources, and creates the potential for compact and cost-effective modulators for real-world applications. By passivating the surfaces of long bulk-lifetime silicon wafers with Al2O3, the recombination of the photoexcited carriers at the surfaces is mostly eliminated. This results in vastly longer excess carrier lifetimes (up to ~50 ms), with corresponding increases in photoconductivity. The resulting modulators are highly efficient, with the transmission through them being reduced from ~90% to <10% over a narrow frequency band with a continuous wave excitation intensity of just 10 Wm−2, whilst modulation factors of greater than 80% can be achieved over a broad band with similar intensities. We also discuss the limitations of such long-lifetime modulators for applications where the switching speed or spatial resolution of a modulator may be critical.

Highlights

  • Photomodulators for mm-wave and THz radiation are an essential component for many imaging and signal processing applications

  • The potentially fast switching speeds of semiconductor-based photomodulators make them excellent candidates for signal processing in communication networks, as well as fast imaging[3,4,5,6]

  • As an indirect bandgap semiconductor with relatively high mobility, is appealing here, especially given its wide availability and relative low cost, though modulators based on other materials, such as germanium, have been reported[17]

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Summary

Introduction

Photomodulators for mm-wave and THz radiation are an essential component for many imaging and signal processing applications. By coating high bulk lifetime, high resistivity silicon wafers with state-of-the-art surface passivating layers, we demonstrate that this surface recombination can be effectively switched off.

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