Abstract

In this paper, we report on commercially viable screen printing (SP) technology to form boron emitters. A screen-printed boron emitter and ion-implanted phosphorus back surface field were formed simultaneously by a co-annealing process. Front and back surfaces were passivated by chemically grown oxide capped with plasma-enhanced chemical vapor deposition silicon nitride stack. Front and back contacts were formed by traditional SP and firing processes with silver/aluminum grid on front and local silver back contacts on the rear. This resulted in 19.6% efficient large area (239 cm2) n-type solar cells with an open-circuit voltage Voc of 645 mV, short-circuit current density Jsc of 38.6 mA/cm2, and fill factor of 78.6%. This demonstrates the potential of this novel technology for production of low-cost high-efficiency n-type silicon solar cells. Copyright © 2014 John Wiley & Sons, Ltd.

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