High dislocation density of tin induced by electric current

Yi-Han Liao,Kwang-Lung Lin,Chien-Lung Liang,Albert T Wu

doi:10.1063/1.4937909

Yi-Han Liao, Kwang-Lung Lin + Show 2 more

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https://doi.org/10.1063/1.4937909

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Abstract

A dislocation density of as high as 1017 /m2 in a tin strip, as revealed by high resolution transmission electron microscope, was induced by current stressing at 6.5 x 103 A/ cm2. The dislocations exist in terms of dislocation line, dislocation loop, and dislocation aggregates. Electron Backscattered Diffraction images reflect that the high dislocation density induced the formation of low deflection angle subgrains, high deflection angle Widmanstätten grains, and recrystallization. The recrystallization gave rise to grain refining.

Highlights

A dislocation density of as high as 1017 /m2 in a tin strip, as revealed by high resolution transmission electron microscope, was induced by current stressing at 6.5 x 103 A/ cm[2]
Electron Backscattered Diffraction images reflect that the high dislocation density induced the formation of low deflection angle subgrains, high deflection angle Widmanstätten grains, and recrystallization
The values of activation energy and stress exponent, decreases from 24 to 9 after current stressing, of the creep behavior of the Sn joint suggested the change of creep mechanism from dislocation climb to grain boundary diffusion

Summary

Introduction

A dislocation density of as high as 1017 /m2 in a tin strip, as revealed by high resolution transmission electron microscope, was induced by current stressing at 6.5 x 103 A/ cm[2]. High dislocation density of tin induced by electric current

Results

Conclusion