Abstract
Polymer-ceramic nanocomposites based on new concepts were developed for embedded capacitor applications. The dielectric constant was above 80 at 1 MHz and the specific capacitance was successfully achieved 8 nF/cm2. By use of this nanocomposites, multilayer printed wiring boards with embedded passive components were fabricated for prototypes. High dielectric constant Barium titanate (BaTiO3) beads surface modification based on a new concept was applied to improve the affinity between BaTiO3 particles and polymer matrix. Next, the blend polymer of an aromatic polyamide (PA) and an aromatic bismaleimide (BMI) was employed as the matrix as from a view-point of both the processabilty during fabricating the substrates with embedded passive components and the thermal stability during assembling LSI chips. Finally, these technologies were combined and optimized for embedded capacitor materials.
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